ADVANCE CF took the lead in deploying advanced processes of 12nm and below. Relying on nanosheet transistor architecture and backside power delivery technology, it can stably mass-produce chips with 12nm, 10nm, 7nm and more advanced nodes, balancing extreme performance and ultra-low power consumption, and ranking among the advanced echelons in the industry.
The products are widely used in scenarios such as high-end mobile phones, AI servers, and autonomous driving on-board chips, and can provide full-process customized process adaptation services from architecture design to packaging and testing.
In terms of core technology, the products adopt FinFET/nanosheet 3D transistor structure. Compared with 16nm, the 12nm process has a performance improvement of more than 20% and a power consumption reduction of 30%; nodes of 7nm and below adopt ultra-low resistance RDL wiring layers and high-performance MiM capacitors, with chip density increased by more than 1.8 times.
It is equipped with independent timing optimization and physical verification technology, effectively solving pain points such as signal interference and timing deviation, and ensuring stability in high-frequency operation.
